数据手册- Capacity
- 1TB
- Flash
- TLC
- Temp.max.
- 85°C °C
- Temp.min.
- -40°C °C
- Formfactor
- 2280
- Interface
- PCIE3.0X4
- P(tot)
- NO
- RoHS Status
- RoHS-conform
- 包装
- INDIVIDUAL
- 出口控制分类编号
- EAR99
- 海关税号
- 85235110000
- 国家或地区
- Taiwan
- ABC 编码
- A
- 生产商交期
- 8 周
ATP’s M.2 2280 NVMe solid state modules based on the NVMe™ protocol
and leveraging the PCI Express® (PCIe®) Gen3 x4 interface deliver
speedy, reliable, and enduring performance to fulfill the increasing
data storage demands of today’s embedded and industrial applications.
Constructed
with 3D triple level cell (TLC) NAND flash, these modules are available
in different capacities, ranging from 40 GB to 3.84 TB, to meet diverse
data storage needs.ATP NVMe SSDs with industrial operating temperature
rating deliver stable performance even in extreme temperatures ranging
from -40°C to 85°C.
Select ATP M.2 2280 NVMe modules adopt a
Customizable Thermal Management Solution. This includes firmware and
hardware options, such as copper foil and fin-type heatsink, to
effectively dissipate heat and ensure optimal levels of sustained
performance.
Features:
- MCU-based Power Loss Protection Design with Level 4 (data-in-flight) protection*
- Self-Encrypting Drive (SED) with AES 256-bit encryption, TCG Opal 2.0*
- Thermal Heatsink Solutions**
- End-to-End Data Path Protection
- TRIM function support
** Customization available on a project basis
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