数据手册- Configuration
- N-CH
- V(DS)
- 600 V
- I(D)at Tc=25°C
- 13 A
- RDS(on)at 10V
- 164 mOhm
- Q(g)
- 18 nC
- P(tot)
- 76 W
- R(thJC)
- 1,65 K/W
- Logic level
- NO
- Mounting
- SMD
- Technology
- CoolMOS G7
- Fast bodydiode
- NO
- P(tot)
- NO
- 封装
- HDSOP-10
- RoHS Status
- RoHS-conform
- 包装
- REEL
- 生产商产品料号
- SP001632844
- 出口控制分类编号
- EAR99
- 海关税号
- 85412900000
- 国家或地区
- Malaysia
- ABC 编码
- A
- 生产商交期
- 19 周
Description:
Summary of Features
- Gives best-in-class FOM RDS(on) x Eoss and RDS(on) x Qg
- Innovative top-side cooling concept
- Inbuilt 4th pin Kelvin source configuration and low parasitic source inductance
- TCOB capability of >> 2.000 cycles, MSL1 compliant and total Pb-free
Benefits
- Enabling highest energy efficiency
- Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
- Reduced parasitic source inductance improves e iciency and ease-of-use
- Enables higher power density solutions
- Exceeding the highest quality standards
Target Applications
- Target Applications:
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