数据手册- V(RRM)
- 1800 V
- I(TRMS)eff
- 520 A
- I(TAVM)
- 320 A
- I(TSM)
- 9500 A
- I(GT)max
- 150 mA
- V(GT)max
- 2 V
- Tvj max
- 130 °C
- Material techn.
- SI
- Configuration
- Pahse Cont
- Housing
- Modul
- P(tot)
- NO
- 封装
- PB50SB-1
- RoHS Status
- RoHS-conform
- 包装
- TRAY
- 生产商产品料号
- SP001713544
- 出口控制分类编号
- EAR99
- 海关税号
- 85413000000
- 国家或地区
- Hungary
- ABC 编码
- A
- 生产商交期
- 18 周
Description:
Summary of Features
- Solder-Bond Technology
- Industrial standard package
- Electrically insulated copper base plate
Benefits
- Cost effective solution for higher competitiveness
- Predictably high performance and lifetime due to 100% x-ray monitoring
- Solid base plate for fast and easy mounting
- One-stop-shop due to complete module technology portfolio
Target Applications
- drives
- ups
- welding
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